newest SiC CMP Carrier Plate

Newest SiC CMP carrier plates deliver superior hardness, thermal stability, and precision for advanced, high-efficiency semiconductor polishing processes

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SiC CMP Carrier Plate

SiC CMP Carrier Plate

Product Features: High flatness, high parallelism, long service life

Contact Information:

Mr. Bernard Wu, cellphone: 139 1855 2249

Email: Bernard.wu@huacera.com.cn

Mr. Ellen Cai, cellphone: 156 0166 7951

Email: sales@huacera.com

Address: No. 301 Chengye Road, Sheshan Town, Songjiang District, Shanghai

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