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Products and Applications
Products and Applications
SiC CMP Carrier Plate
• Product Features: High flatness, high parallelism, long service life
• Product Applications: RTP (Rapid Thermal Processing) carrier plate, used for rapid heating and cooling thermal processing in semiconductor manufacturing, such as annealing, doping, and oxidation. CMP (Chemical Mechanical Polishing) carrier plate, used for wafer polishing.
SiC CMP carrier plates are critical components used in semiconductor manufacturing, specifically in the chemical mechanical polishing (CMP) process. Made from silicon carbide (SiC), these plates offer exceptional hardness, thermal stability, and wear resistance, ensuring consistent and precise wafer polishing. Their high strength and durability allow them to maintain flatness and stability under demanding conditions, improving process accuracy and yield. SiC CMP carrier plates are widely used in advanced semiconductor production, supporting high-performance applications in electronics and microchip fabrication.
Contact Information:
Mr. Bernard Wu, cellphone: 139 1855 2249
Email: Bernard.wu@huacera.com.cn
Mr. Ellen Cai, cellphone: 156 0166 7951
Email: sales@huacera.com
Address: No. 301 Chengye Road, Sheshan Town, Songjiang District, Shanghai
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