Products and Applications
SiC wafer chucks
Characteristics of Silicon Carbide Wafer Chuck
Wafer chucks are widely used in semiconductor manufacturing and optoelectronics manufacturing fields, mainly as components for semiconductor photolithography, measurement, bonding, and wafer cleaning equipment, with the following characteristics:
- High precision, high thermal conductivity, high specific stiffness, minimal deformation
- High purity, no metal ion contamination
- Uniform grain size, effectively reducing particle and chemical cleaning contamination issues
- Good flatness and parallelism, smooth surface that will not scratch wafers
- High lightweight design, extremely low wafer contact area
Wafer Chuck Technical Parameters and Specifications
- Flatness: <0.3μm (RMS）, Parallelism: ≤1μm
- Surface features: bump type, through-hole type, groove type
- Applicable specifications: 6", 8", 6/8", 12", 8/12"
- Pin height: 0.05-0.2mm
- Minimum pin diameter: Φ0.2mm
- Minimum pin pitch: 2.5mm
- Minimum sealing ring width: 0.4mm
- Surface roughness: Ra0.04
- Thickness tolerance: ±0.005mm
- Diameter tolerance: ±0.01mm
- Side hole features: integral processing, minimum diameter 3mm, maximum length 170mm
