Products and Applications
SiC PVD Carrier Plate
• Product Features: High flatness, high parallelism, long service life
• Product Applications: RTP (Rapid Thermal Processing) carrier plate, used for rapid heating and cooling thermal processing in semiconductor manufacturing, such as annealing, doping, and oxidation. CMP (Chemical Mechanical Polishing) carrier plate, used for wafer polishing.
SiC PVD Carrier Plate is a high-performance component designed for demanding PVD coating and semiconductor processing environments. Made from silicon carbide, it offers excellent high-temperature resistance, thermal stability, mechanical strength, and corrosion resistance. Its low thermal expansion helps maintain dimensional stability during repeated heating and cooling cycles. The carrier plate can support wafers, substrates, or other workpieces during processing, helping improve positioning accuracy and process consistency. With customizable dimensions, thicknesses, hole patterns, and structural designs, SiC PVD Carrier Plate can be adapted to different equipment and production requirements. It is suitable for applications requiring reliable performance under high temperatures, vacuum conditions, and corrosive process environments.