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Shanghai Huashuo Advanced Ceramics participated in the 13th Semiconductor Equipment, Core Components and Materials Exhibition
Release Time:
2025-09-05
| September 4-6, 2025 The 13th Semiconductor Equipment, Core Components, and Materials Exhibition Wuxi Taihu International Expo Center Booth No.: A4-765A |
September 4-6, 2025，Shanghai Huashuo Advanced Ceramics showcased its precision silicon carbide components for semiconductor equipment, including pin chucks, ring wafer chucks, silicon carbide plates for key wafer processing, silicon carbide mirrors, and trays, at the 13th Semiconductor Equipment, Core Components, and Materials Exhibition 2025. Engineers from numerous semiconductor fabs and equipment manufacturers expressed strong interest in the quality of Huashuo's high-performance silicon carbide materials and components. We discussed a wide range of material and engineering topics, established connections with several equipment manufacturers, and expressed our intention to strengthen communication and establish deeper collaborations after the meeting.
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